OnLogic Neousys Rugged Intel® Coffee Lake Low Profile Fanless Computer
Part Number: NUVO-7000LP
HEXA-CORE PROCESSING CAPABLE
The Nuvo-7000LP features Intel’s 8th Gen Intel® Core processing, bringing with it a number of performance features. Four cores are now available on the Core i3, and a remarkable six cores are available on the i5 and i7, offering a level of performance not usually found at this price. With support for 2666 MHz DDR4 memory and UHD integrated graphics, the Nuvo-7000LP gets a significant performance increase over previous generations. The Nuvo-7000LP is also available with optional 4G LTE connectivity, enabling remote network access or failover protection.
LOW PROFILE, HIGH RELIABILITY
Neousys’ most rugged embedded system to date, the Nuvo-7000LP easily handles the most demanding deployments with its wide operating temperature and power input range, sophisticated ESD and power surge protection, and fanless design that keeps out dust and debris, significantly extending the life of the system. Its low 79mm profile still finds room for a front-accessible 2.5” drive hot-swap bay that supports RAID 0/1 when configured with an internal SATA drive.
VERSATILE I/O
The Nuvo-7000LP fits seamlessly into a range of industrial applications with its flexible combination of both legacy and modern I/O. New to this generation are four USB 3.1 Gen 2 ports for blazing fast 10 Gbps data speeds and a PCIe Gen3 x4 NVMe M.2 SSD that offers read speeds of up to 1800 MB/s. Either two or six Gb LAN ports (four of which can be 802.3at PoE+) paired with its front-accessible 2.5” drive hot-swap bay makes it ideal for surveillance and security applications. For maximum flexibility, the Nuvo-7000LP can add a range of additional I/O via its MezIO™ expansion cards.
CELLULAR CONNECTIVITY
This system is compatible with our Extrovert 4G LTE technology, an integrated modem pre-certified to operate on many of the world’s most popular cellular carrier networks. Extrovert 4G LTE hardware is ideal for today’s mobile, edge computing and Industrial Internet of Things applications. To take advantage of this feature, simply configure your system with Extrovert 4G LTE connectivity and then contact your carrier to activate.
Hardware Line | Rugged |
---|---|
Cooling Type | Fanless |
Processor Socket | LGA1151 |
Processor Generation | Coffee Lake |
Processor Cores | 2 4 6 |
Chipset | Intel Q370 |
Graphics/GPU | Intel UHD Graphics 630 |
Memory Type | DDR4 SO-DIMM (non-ECC) |
Memory Capacity | 32 GB |
Memory Speed | 2400 MHz 2666 MHz |
Memory Slot Count | 2.000000 |
Number of Displays Supported | 3 |
Rear I/O | 2 RS-232/422/485 COM ports 2 RS-232 COM ports 1 3-pin terminal block 1 3-pin terminal block for remote control and PWR LED output 1 MezIO expansion port |
Front I/O | 4 USB 3.2 Gen 2 ports 4 USB 3.2 Gen 1 ports 2 LAN ports (4 additional with Nuvo-7006LP) 1 DisplayPort Connector 1 VGA port 1 DVI-D port 2 Front -Accessible SIM sockets |
Expansion Options | 1 M.2 2242 slot 1 Neousys MezIO Module |
Storage Options | 1 mSATA (shared with mPCIe) 2.5″ HDD/SSD 2.5″ Hot-swap HDD/SSD 1 M.2 NGFF 2280 slot |
RAID Support | 0/1 |
LAN Controller | Intel I210 GbE Intel I219 GbE |
System Monitoring | TPM 2.0 Support AMT 12.0 Support |
Input Voltage | 8~35 VDC |
Power Input | 3-pin Terminal Block connector |
Operating Temperature Range | -25 ~ 50°C (w/ 65W CPU) -25 ~ 70°C (w/ 35W CPU) |
Operating Humidity | 10% ~ 90% (non-condensing) |
Shock Tolerance (Operating) | Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
Vibration Tolerance (Operating) | Operating, MIL-STD-810G, Method 514.6, Category 4 |
Dimensions (WxHxD) | 240 x 79 x 225 mm 9.45″ x 3.11″ x 8.86″ |
Case Type | Fanless Ruggedized |
Case Material | Aluminum Extrusion Steel |
Port Punchouts | 4 Antenna holes |
Mounting Options | Wall-mount (kit included) |