Part no: 4SH75AV

HP BU IDS Z240 SFF WKS 4SH75AV

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HP Z240 Small Form Factor Workstation

Part Number: 4SH75AV

The HP Z240 SFF workstation gives you speedy, ISV-certified hardware components in a desktop PC that fits in a compact cubicle. It’s a quick system that’ll work well for a growing SMB.

Specification
Description
System board form factor
ATX 24.38 x 24.38 mm (9.6 x 9.6 in)
Processor socket
Single LGA 1151
CPU bus speed
DMI
Chipset
Intel PCH C236
Memory expansion slots
4 DDR4 memory slots
Memory type supported
DDR4, UDIMM (unbuffered), ECC and non-ECC
Memory modes
Non-Interleaved for single channel. Interleaved when both channels are populated.
Memory speed supported
2133MT/s DDR4
Memory protection
ECC available on data
Maximum memory
64 GB
Memory configuration
4GB, 8GB and 16GB non-ECC/4GB, 8GB and 16GB ECC unbuffered DIMMs are supported. ECC and non-ECC memory DIMMs cannot be mixed on the same system.
PCI express connectors
1 PCI Express Gen3 slot x 1 mechanical/ x 1 electrical (LP, half length)
1 PCI Express Gen3 slot x 16 mechanical/ x 16 electrical (LP, half length)
1 PCI Express Gen3 slot x 1 mechanical/ x 1 electrical (LP, half length)
1 PCI Express Gen3 slot x 16 mechanical/ x 4 electrical (LP, half length)

NOTE:

In the PCIe Gen3 (x 16 electrical/x 16 mechanical) slot, if it is not being used for a graphics card, only cards certified as After Market Options for this platform are supported.
Supported drive interfaces
SATA: Integrated (4) Serial ATA interfaces (6 Gb/s SATA). One port can optionally be used for eSATA. RAID 0 and 1 supported. Factory integrated RAID is Microsoft Windows only. RAID 5 is supported by Software XOR.
Serial Attached SCSI: None.
Integrated RAID:

NOTE:

Requires identical hard drives (speeds, capacity, interface)
Integrated graphics:

  • Intel HD Graphics 530 (on Core i3/i5/i7-6xxx processors); Intel Integrated Graphics for Xeon processors
  • Based on Unified Memory Architecture (UMA) – a region of system memory is reserved and dedicated to the graphics display.
  • Support for Microsoft DirectX 11, OpenGL 4.0 and OpenCL 1.2 on Intel HD Graphics P530
  • 3 DP 1.2 graphics ports integrated in motherboard; Supports up to three simultaneous displays across DP outputs. Max resolution supported: 3840 x 2160 at 60Hz
Network Controller: Integrated Ethernet PHY Connection I219LM. Management capabilities: WOL, PXE 2.1 and AMT 9
IDE connector: No
Floppy connector: No
Serial: 1 rear port
2nd Serial: Yes (optional serial port adapter kit required)
Parallel: 1 internal header (optional parallel port adapter required)
HD integrated audio: Yes
USB Connectors
Front: 2 USB 3.0, 2 USB 2.0
Rear: 6 USB 3.0
Internal: 1 USB 3.0, 2 USB 2.0
HD integrated audio
Yes
Flash ROM
Yes
Chassis fan header
N/A
Front control panel/speaker header
Yes
CMOS battery holder – lithium
Yes
Integrated trusted platform module
Integrated TPM 1.2.
Power supply headers
Yes
Power switch, power LED & hard drive LED header
Yes
Clear password jumper
Yes
Keyboard/mouse
USB or PS/2
Operating voltage range
90-264 VAC
Rated voltage range
100-240 VAC
Rated line frequency
50-60 Hz
Operating line frequency range
47-63 Hz
Rated input current
4A at 100-240 V
Heat dissipation
Typical: 444 btu/hr (112 kcal/hr)
Maximum: 890 btu/hr (224 kcal/hr)
Power supply fan
70 mm x 70 mm x 25 mm 4-wire PWM
ENERGY STAR qualified (config dependent)
Yes
FEMP standby power compliant
Yes, with wake-on-LAN disabled: <2W in 55 – Power Off
Surge tolerant full ranging power supply (withstands power surges up to 2000 V)
Yes
Hood lock header
Yes
DrP Lot 6- Tier 2 Compliance at 230 V
Yes
Environmental requirements
Temperature:
Operating: 5° to 35° C (40° to 95° F)
Non-operating: -40° to 60° C (-40° to 140° F)
Maximum altitude
Operating: 3,000 m (10,000 ft)
Non-operating: 9,100 m (30,000 ft)
Humidity:
Operating: 8% to 85% RH (non-condensing)
Non-operating: 8% to 90%
Shock
Operating: 40 g, 2-3 ms, half-sine
Non-operating: 160 cm/s, 2-3 ms, (~100g) Square: 422 cm/s, 20 g
Cooling
Above 1524 m (5,000 ft) altitude, maximum operating temperature is de-rated by 1° C (1.8° F) per 305 m (1000 ft) elevation increase.